Fan-Out Wafer Level Packaging Market - Global Outlook and Forecast 2021-2027

Code: RW00014517675
Market Monitor Global
Sep-2021
Electronics and Semiconductor
93 Pages

This report contains market size and forecasts of Fan-Out Wafer Level Packaging in Global, including the following market information:
Global Fan-Out Wafer Level Packaging Market Revenue, 2016-2021, 2022-2027, ($ millions)
Global top five companies in 2020 (%)
The global Fan-Out Wafer Level Packaging market was valued at 1172.4 million in 2020 and is projected to reach US$ 2369.7 million by 2027, at a CAGR of 19.2% during the forecast period.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Fan-Out Wafer Level Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Fan-Out Wafer Level Packaging Market, By Type, 2016-2021, 2022-2027 ($ millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, By Type, 2020 (%)
High Density Fan-Out Package
Core Fan-Out Package

China Fan-Out Wafer Level Packaging Market, By Application, 2016-2021, 2022-2027 ($ millions)
China Fan-Out Wafer Level Packaging Market Segment Percentages, By Application, 2020 (%)
CMOS Image Sensor
A Wireless Connection
Logic and Memory Integrated Circuits
Mems and Sensors
Analog and Hybrid Integrated Circuits
Others

Global Fan-Out Wafer Level Packaging Market, By Region and Country, 2016-2021, 2022-2027 ($ Millions)
Global Fan-Out Wafer Level Packaging Market Segment Percentages, By Region and Country, 2020 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa

Competitor Analysis
The report also provides analysis of leading market participants including:
Total Fan-Out Wafer Level Packaging Market Competitors Revenues in Global, by Players 2016-2021 (Estimated), ($ millions)
Total Fan-Out Wafer Level Packaging Market Competitors Revenues Share in Global, by Players 2020 (%)
Further, the report presents profiles of competitors in the market, including the following:
TSMC
ASE Technology Holding Co.
JCET Group
Amkor Technology
Siliconware Technology (SuZhou) Co.
Nepes

Table of Contents

1 Introduction to Research & Analysis Reports
1.1 Fan-Out Wafer Level Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Fan-Out Wafer Level Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Fan-Out Wafer Level Packaging Overall Market Size
2.1 Global Fan-Out Wafer Level Packaging Market Size: 2021 VS 2027
2.2 Global Fan-Out Wafer Level Packaging Market Size, Prospects & Forecasts: 2016-2027
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Fan-Out Wafer Level Packaging Players in Global Market
3.2 Top Global Fan-Out Wafer Level Packaging Companies Ranked by Revenue
3.3 Global Fan-Out Wafer Level Packaging Revenue by Companies
3.4 Top 3 and Top 5 Fan-Out Wafer Level Packaging Companies in Global Market, by Revenue in 2020
3.5 Global Companies Fan-Out Wafer Level Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 Fan-Out Wafer Level Packaging Players in Global Market
3.6.1 List of Global Tier 1 Fan-Out Wafer Level Packaging Companies
3.6.2 List of Global Tier 2 and Tier 3 Fan-Out Wafer Level Packaging Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type - Global Fan-Out Wafer Level Packaging Market Size Markets, 2021 & 2027
4.1.2 High Density Fan-Out Package
4.1.3 Core Fan-Out Package
4.2 By Type - Global Fan-Out Wafer Level Packaging Revenue & Forecasts
4.2.1 By Type - Global Fan-Out Wafer Level Packaging Revenue, 2016-2021
4.2.2 By Type - Global Fan-Out Wafer Level Packaging Revenue, 2022-2027
4.2.3 By Type - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2016-2027
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Fan-Out Wafer Level Packaging Market Size, 2021 & 2027
5.1.2 CMOS Image Sensor
5.1.3 A Wireless Connection
5.1.4 Logic and Memory Integrated Circuits
5.1.5 Mems and Sensors
5.1.6 Analog and Hybrid Integrated Circuits
5.1.7 Others
5.2 By Application - Global Fan-Out Wafer Level Packaging Revenue & Forecasts
5.2.1 By Application - Global Fan-Out Wafer Level Packaging Revenue, 2016-2021
5.2.2 By Application - Global Fan-Out Wafer Level Packaging Revenue, 2022-2027
5.2.3 By Application - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2016-2027
6 Sights by Region
6.1 By Region - Global Fan-Out Wafer Level Packaging Market Size, 2021 & 2027
6.2 By Region - Global Fan-Out Wafer Level Packaging Revenue & Forecasts
6.2.1 By Region - Global Fan-Out Wafer Level Packaging Revenue, 2016-2021
6.2.2 By Region - Global Fan-Out Wafer Level Packaging Revenue, 2022-2027
6.2.3 By Region - Global Fan-Out Wafer Level Packaging Revenue Market Share, 2016-2027
6.3 North America
6.3.1 By Country - North America Fan-Out Wafer Level Packaging Revenue, 2016-2027
6.3.2 US Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.3.3 Canada Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.3.4 Mexico Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.4 Europe
6.4.1 By Country - Europe Fan-Out Wafer Level Packaging Revenue, 2016-2027
6.4.2 Germany Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.4.3 France Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.4.4 U.K. Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.4.5 Italy Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.4.6 Russia Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.4.7 Nordic Countries Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.4.8 Benelux Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.5 Asia
6.5.1 By Region - Asia Fan-Out Wafer Level Packaging Revenue, 2016-2027
6.5.2 China Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.5.3 Japan Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.5.4 South Korea Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.5.5 Southeast Asia Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.5.6 India Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.6 South America
6.6.1 By Country - South America Fan-Out Wafer Level Packaging Revenue, 2016-2027
6.6.2 Brazil Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.6.3 Argentina Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa Fan-Out Wafer Level Packaging Revenue, 2016-2027
6.7.2 Turkey Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.7.3 Israel Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.7.4 Saudi Arabia Fan-Out Wafer Level Packaging Market Size, 2016-2027
6.7.5 UAE Fan-Out Wafer Level Packaging Market Size, 2016-2027
7 Players Profiles
7.1 TSMC
7.1.1 TSMC Corporate Summary
7.1.2 TSMC Business Overview
7.1.3 TSMC Fan-Out Wafer Level Packaging Major Product Offerings
7.1.4 TSMC Fan-Out Wafer Level Packaging Revenue in Global (2016-2021)
7.1.5 TSMC Key News
7.2 ASE Technology Holding Co.
7.2.1 ASE Technology Holding Co. Corporate Summary
7.2.2 ASE Technology Holding Co. Business Overview
7.2.3 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Major Product Offerings
7.2.4 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Revenue in Global (2016-2021)
7.2.5 ASE Technology Holding Co. Key News
7.3 JCET Group
7.3.1 JCET Group Corporate Summary
7.3.2 JCET Group Business Overview
7.3.3 JCET Group Fan-Out Wafer Level Packaging Major Product Offerings
7.3.4 JCET Group Fan-Out Wafer Level Packaging Revenue in Global (2016-2021)
7.3.5 JCET Group Key News
7.4 Amkor Technology
7.4.1 Amkor Technology Corporate Summary
7.4.2 Amkor Technology Business Overview
7.4.3 Amkor Technology Fan-Out Wafer Level Packaging Major Product Offerings
7.4.4 Amkor Technology Fan-Out Wafer Level Packaging Revenue in Global (2016-2021)
7.4.5 Amkor Technology Key News
7.5 Siliconware Technology (SuZhou) Co.
7.5.1 Siliconware Technology (SuZhou) Co. Corporate Summary
7.5.2 Siliconware Technology (SuZhou) Co. Business Overview
7.5.3 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Major Product Offerings
7.5.4 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Revenue in Global (2016-2021)
7.5.5 Siliconware Technology (SuZhou) Co. Key News
7.6 Nepes
7.6.1 Nepes Corporate Summary
7.6.2 Nepes Business Overview
7.6.3 Nepes Fan-Out Wafer Level Packaging Major Product Offerings
7.6.4 Nepes Fan-Out Wafer Level Packaging Revenue in Global (2016-2021)
7.6.5 Nepes Key News
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer

List of Tables
Table 1. Fan-Out Wafer Level Packaging Market Opportunities & Trends in Global Market
Table 2. Fan-Out Wafer Level Packaging Market Drivers in Global Market
Table 3. Fan-Out Wafer Level Packaging Market Restraints in Global Market
Table 4. Key Players of Fan-Out Wafer Level Packaging in Global Market
Table 5. Top Fan-Out Wafer Level Packaging Players in Global Market, Ranking by Revenue (2019)
Table 6. Global Fan-Out Wafer Level Packaging Revenue by Companies, (US$, Mn), 2016-2021
Table 7. Global Fan-Out Wafer Level Packaging Revenue Share by Companies, 2016-2021
Table 8. Global Companies Fan-Out Wafer Level Packaging Product Type
Table 9. List of Global Tier 1 Fan-Out Wafer Level Packaging Companies, Revenue (US$, Mn) in 2020 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Fan-Out Wafer Level Packaging Companies, Revenue (US$, Mn) in 2020 and Market Share
Table 11. By Type

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