Through-Silicon Vias Market - Global Outlook and Forecast 2021-2027

Code: RW00014300865
Market Monitor Global
Jun-2021
Electronics and Semiconductor
93 Pages

This report contains market size and forecasts of Through-Silicon Vias (TSVs) in Global, including the following market information:
Global Through-Silicon Vias (TSVs) Market Revenue, 2016-2021, 2022-2027, ($ millions)
Global top five companies in 2020 (%)
The global Through-Silicon Vias (TSVs) market was valued at 1502.8 million in 2020 and is projected to reach US$ 3309.5 million by 2027, at a CAGR of 21.8% during the forecast period.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Through-Silicon Vias (TSVs) companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Through-Silicon Vias (TSVs) Market, By Type, 2016-2021, 2022-2027 ($ millions)
Global Through-Silicon Vias (TSVs) Market Segment Percentages, By Type, 2020 (%)
2.5D Through-Silicon Vias
3D Through-Silicon Vias

China Through-Silicon Vias (TSVs) Market, By Application, 2016-2021, 2022-2027 ($ millions)
China Through-Silicon Vias (TSVs) Market Segment Percentages, By Application, 2020 (%)
Mobile And Consumer Electronics
Communication Equipment
Automotive And Transportation Electronics

Global Through-Silicon Vias (TSVs) Market, By Region and Country, 2016-2021, 2022-2027 ($ Millions)
Global Through-Silicon Vias (TSVs) Market Segment Percentages, By Region and Country, 2020 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa

Competitor Analysis
The report also provides analysis of leading market participants including:
Total Through-Silicon Vias (TSVs) Market Competitors Revenues in Global, by Players 2016-2021 (Estimated), ($ millions)
Total Through-Silicon Vias (TSVs) Market Competitors Revenues Share in Global, by Players 2020 (%)
Further, the report presents profiles of competitors in the market, including the following:
ASE Technology Holding
Amkor Technology
Taiwan Semiconductor Manufacturing Company Limited
Intel Corporation
GLOBALFOUNDRIES
JCET Group
Samsung
Tianshui Huatian Technology

Table of Contents

1 Introduction to Research & Analysis Reports
1.1 Through-Silicon Vias (TSVs) Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Through-Silicon Vias (TSVs) Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Through-Silicon Vias (TSVs) Overall Market Size
2.1 Global Through-Silicon Vias (TSVs) Market Size: 2021 VS 2027
2.2 Global Through-Silicon Vias (TSVs) Market Size, Prospects & Forecasts: 2016-2027
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
3.1 Top Through-Silicon Vias (TSVs) Players in Global Market
3.2 Top Global Through-Silicon Vias (TSVs) Companies Ranked by Revenue
3.3 Global Through-Silicon Vias (TSVs) Revenue by Companies
3.4 Top 3 and Top 5 Through-Silicon Vias (TSVs) Companies in Global Market, by Revenue in 2020
3.5 Global Companies Through-Silicon Vias (TSVs) Product Type
3.6 Tier 1, Tier 2 and Tier 3 Through-Silicon Vias (TSVs) Players in Global Market
3.6.1 List of Global Tier 1 Through-Silicon Vias (TSVs) Companies
3.6.2 List of Global Tier 2 and Tier 3 Through-Silicon Vias (TSVs) Companies
4 Market Sights by Product
4.1 Overview
4.1.1 By Type - Global Through-Silicon Vias (TSVs) Market Size Markets, 2021 & 2027
4.1.2 2.5D Through-Silicon Vias
4.1.3 3D Through-Silicon Vias
4.2 By Type - Global Through-Silicon Vias (TSVs) Revenue & Forecasts
4.2.1 By Type - Global Through-Silicon Vias (TSVs) Revenue, 2016-2021
4.2.2 By Type - Global Through-Silicon Vias (TSVs) Revenue, 2022-2027
4.2.3 By Type - Global Through-Silicon Vias (TSVs) Revenue Market Share, 2016-2027
5 Sights by Application
5.1 Overview
5.1.1 By Application - Global Through-Silicon Vias (TSVs) Market Size, 2021 & 2027
5.1.2 Mobile And Consumer Electronics
5.1.3 Communication Equipment
5.1.4 Automotive And Transportation Electronics
5.2 By Application - Global Through-Silicon Vias (TSVs) Revenue & Forecasts
5.2.1 By Application - Global Through-Silicon Vias (TSVs) Revenue, 2016-2021
5.2.2 By Application - Global Through-Silicon Vias (TSVs) Revenue, 2022-2027
5.2.3 By Application - Global Through-Silicon Vias (TSVs) Revenue Market Share, 2016-2027
6 Sights by Region
6.1 By Region - Global Through-Silicon Vias (TSVs) Market Size, 2021 & 2027
6.2 By Region - Global Through-Silicon Vias (TSVs) Revenue & Forecasts
6.2.1 By Region - Global Through-Silicon Vias (TSVs) Revenue, 2016-2021
6.2.2 By Region - Global Through-Silicon Vias (TSVs) Revenue, 2022-2027
6.2.3 By Region - Global Through-Silicon Vias (TSVs) Revenue Market Share, 2016-2027
6.3 North America
6.3.1 By Country - North America Through-Silicon Vias (TSVs) Revenue, 2016-2027
6.3.2 US Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.3.3 Canada Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.3.4 Mexico Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.4 Europe
6.4.1 By Country - Europe Through-Silicon Vias (TSVs) Revenue, 2016-2027
6.4.2 Germany Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.4.3 France Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.4.4 U.K. Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.4.5 Italy Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.4.6 Russia Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.4.7 Nordic Countries Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.4.8 Benelux Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.5 Asia
6.5.1 By Region - Asia Through-Silicon Vias (TSVs) Revenue, 2016-2027
6.5.2 China Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.5.3 Japan Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.5.4 South Korea Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.5.5 Southeast Asia Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.5.6 India Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.6 South America
6.6.1 By Country - South America Through-Silicon Vias (TSVs) Revenue, 2016-2027
6.6.2 Brazil Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.6.3 Argentina Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.7 Middle East & Africa
6.7.1 By Country - Middle East & Africa Through-Silicon Vias (TSVs) Revenue, 2016-2027
6.7.2 Turkey Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.7.3 Israel Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.7.4 Saudi Arabia Through-Silicon Vias (TSVs) Market Size, 2016-2027
6.7.5 UAE Through-Silicon Vias (TSVs) Market Size, 2016-2027
7 Players Profiles
7.1 ASE Technology Holding
7.1.1 ASE Technology Holding Corporate Summary
7.1.2 ASE Technology Holding Business Overview
7.1.3 ASE Technology Holding Through-Silicon Vias (TSVs) Major Product Offerings
7.1.4 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue in Global (2016-2021)
7.1.5 ASE Technology Holding Key News
7.2 Amkor Technology
7.2.1 Amkor Technology Corporate Summary
7.2.2 Amkor Technology Business Overview
7.2.3 Amkor Technology Through-Silicon Vias (TSVs) Major Product Offerings
7.2.4 Amkor Technology Through-Silicon Vias (TSVs) Revenue in Global (2016-2021)
7.2.5 Amkor Technology Key News
7.3 Taiwan Semiconductor Manufacturing Company Limited
7.3.1 Taiwan Semiconductor Manufacturing Company Limited Corporate Summary
7.3.2 Taiwan Semiconductor Manufacturing Company Limited Business Overview
7.3.3 Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Major Product Offerings
7.3.4 Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Revenue in Global (2016-2021)
7.3.5 Taiwan Semiconductor Manufacturing Company Limited Key News
7.4 Intel Corporation
7.4.1 Intel Corporation Corporate Summary
7.4.2 Intel Corporation Business Overview
7.4.3 Intel Corporation Through-Silicon Vias (TSVs) Major Product Offerings
7.4.4 Intel Corporation Through-Silicon Vias (TSVs) Revenue in Global (2016-2021)
7.4.5 Intel Corporation Key News
7.5 GLOBALFOUNDRIES
7.5.1 GLOBALFOUNDRIES Corporate Summary
7.5.2 GLOBALFOUNDRIES Business Overview
7.5.3 GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Major Product Offerings
7.5.4 GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Revenue in Global (2016-2021)
7.5.5 GLOBALFOUNDRIES Key News
7.6 JCET Group
7.6.1 JCET Group Corporate Summary
7.6.2 JCET Group Business Overview
7.6.3 JCET Group Through-Silicon Vias (TSVs) Major Product Offerings
7.6.4 JCET Group Through-Silicon Vias (TSVs) Revenue in Global (2016-2021)
7.6.5 JCET Group Key News
7.7 Samsung
7.7.1 Samsung Corporate Summary
7.7.2 Samsung Business Overview
7.7.3 Samsung Through-Silicon Vias (TSVs) Major Product Offerings
7.4.4 Samsung Through-Silicon Vias (TSVs) Revenue in Global (2016-2021)
7.7.5 Samsung Key News
7.8 Tianshui Huatian Technology
7.8.1 Tianshui Huatian Technology Corporate Summary
7.8.2 Tianshui Huatian Technology Business Overview
7.8.3 Tianshui Huatian Technology Through-Silicon Vias (TSVs) Major Product Offerings
7.8.4 Tianshui Huatian Technology Through-Silicon Vias (TSVs) Revenue in Global (2016-2021)
7.8.5 Tianshui Huatian Technology Key News
8 Conclusion
9 Appendix
9.1 Note
9.2 Examples of Clients
9.3 Disclaimer

List of Tables
Table 1. Through-Silicon Vias (TSVs) Market Opportunities & Trends in Global Market
Table 2. Through-Silicon Vias (TSVs) Market Drivers in Global Market
Table 3. Through-Silicon Vias (TSVs) Market Restraints in Global Market
Table 4. Key Players of Through-Silicon Vias (TSVs) in Global Market
Table 5. Top Through-Silicon Vias (TSVs) Players in Global Market, Ranking by Revenue (2019)
Table 6. Global Through-Silicon Vias (TSVs) Revenue by Companies, (US$, Mn), 2016-2021
Table 7. Global Through-Silicon Vias (TSVs) Revenue Share by Companies, 2016-2021
Table 8. Global Companies Through-Silicon Vias (TSVs) Product Type
Table 9. List of Global Tier 1 Through-Silicon Vias (TSVs) Companies, Revenue (US$, Mn) in 2020 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Through-Silicon Vias (TSVs) Companies, Revenue (US$, Mn) in 2020 and Market Share
Table 11. By Type

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