Report : Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Platform (IC Package Substrate, Rigid Board, and Flexible Board), Application (Smartphones and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Other Applications), and Industry (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Other Industries), Geography
According to the new research report titled “Embedded Die Packaging Technology Market Forecast to 2028 – COVID-19 Impact and Global Analysis,” published by The Insight Partners, the market is expected to reach US$ 242.80 million by 2028, registering a CAGR of 18.6% from 2021 to 2028.
The semiconductor industry is offering innovative products to support digitalization. Rising demand for IoT-based electronic devices to enhance connectivity is further propelling the market growth. Advent of Internet of Things (IoT) connectivity in the global market has created lucrative opportunity for the market players to develop a new line of IoT-compatible electronic devices. Rising miniaturization of electronics to optimize space and design is being fulfilled with embedded die packaging technology. New electronic devices need to offer enhanced performance within a similar space for which major companies are selecting embedded die packaging technology. The advanced packaging technologies have the capacity to resolve the micro-chip performance requirements. Embedded die packaging technology offers solution for various issues such as heat dissipation, power consumption, and product dimension with embedded die for enhanced performance. The embedded die packaging technology is gaining major adoption from North America, Europe and Asia, while the Middle East & Africa and South America are likely to be the potential markets during the forecast period.
Further, advent of smart electronic devices with the integration of multiple processors, sensors, and other components is accelerating the market growth. Technology is playing a vital role in developing electronics with a smaller size and low power requirement. Several market players, including Intel, AT&S, and Schweizer, are developing new solutions based on embedded die packaging technology for the consumer market. For instance, Samsung Electro-Mechanics Co. (SEMCO) has developed a six-layer PCB substrate technology to be used in Qualcomm QET5100M envelope tracker for mobile handset applications.
Key Findings of Study:
The global embedded die packaging technology market is fragmented into four major regions—North America, Asia Pacific (APAC), Europe, and Rest of the World. The market in APAC is projected to experience a significant growth during the forecast period. The North America region is projected to grow at the highest CAGR over the forecast period, owing to the strong presence of the semiconductor manufacturing industry and supporting government policies for microelectronics. The region has several electronics manufacturing industries. However, the North American market suffered a huge loss in the first half of 2020, owing to the rising number of COVID-19 cases, specifically in the US. Post-lockdown, the market witnessed increase in demand for digital devices. North America is among the eminent regions in adopting smart or IoT-based devices due to favorable infrastructure support for high-speed internet services. The adoption of the 5G network is supposed to drive the market post-lockdown. The COVID-19 outbreak had a major impact on manufacturing facilities as production capacities were lowered. As the demand for electronics remained constant, it helped the market to resume the growth. For instance, in December 2020, Qualcomm Inc, a leading manufacturer of microprocessors predicted that the shipments of 5G smartphones would double by 2022, with the increasing 5G network deployment. Such increasing adoption of 5G smartphones is lowering the COVID-19 impact on the market during the post-lockdown period.
Nevertheless, significant strategic initiatives by several industry players are observed in the market; for instance, in February 2018, Microsemi company introduced new ZL70123 radio frequency (RF) base station module developed using company's ZL70323 implant module for next-generation medical networks (Med-Net).